.Morton Photonics Inc
Morton Photonics (MP) develops advanced photonic component and sub-system technologies for RF Photonics and sensing systems, plus applications of these technologies in future datacenter, datacom and optical fiber communications systems.​​  Our focus is on Photonic Integration on the Silicon Photonics Platform, including heterogeneous integration of additional materials to provide the high performance required by advanced analog DoD systems; specifically III-V materials for optical gain, phase modulation and detection, Ce:YIG for optical isolation, silicon nitride for ultra-low loss waveguides, and PZT for ultra-low power actuators.

MP designs advanced photonic components though simulation and measurements of fabricated devices; tested in MPs two photonics labs, the high-speed lab (shown below) that includes equipment for measurements up to 50GHz and beyond, or the low noise lab that includes equipment for measuring laser noise and optical vector network analyzer (OVA) measurements of components.  We work with partners for device fabrication, manufacturing partners to commercialize the photonic devices, and with system companies / Prime contractors to transition the technologies to DoD and commercial platforms.
Silicon Photonics devices and Photonic Integrated Circuits (PICs) are being developed by MP to provide unique functionality for Phased Array Systems; containing low noise lasers, integrated isolators, optical modulators, filters, optical true time delay devices and photodetector arrays. These integrated devices are being developed through their own DoD funded programs, each producing record performance in their field, while systems focused programs integrate these devices to form advanced photonic integrated circuit (PIC) devices and modules, enabling the use of photonics in DoD systems through new capabilities, lower Size, Weight and Power - Cost (SWaP-C).

MP works closely with partners at universities and companies; small and large, to develop state of the art integrated photonic devices, PICs, sub-systems and systems.  A key collaboration is with the world leading Bowers Photonics Group at the University of California at Santa Barbara (UCSB), which provides the heterogeneous Silicon Photonics technology on which MPs devices and PICs are developed. This collaboration supports the creation of new technologies and devices for use in MPs PICs and systems.

​​​MP works with the AIM Photonics Foundry, of which UCSB is the West Coast Hub, i.e. R&D center, to support transition of new technologies and devices to the AIM Photonics Foundry, where manufacturing and packaging of MPs PICs is planned.
​MP carries out Photonics R&D in a range of overlapping areas, including:

    o    RF Photonics Devices and Sub-systems
    o    Optical Sensing Devices and Sub-systems
    o    Hybrid Integrated Ultra-Low Noise Lasers

    o    Silicon Photonics with Heterogeneous Integration
    o    Silicon Photonics Ultra-Low Noise Lasers

    o    Silicon Photonics Isolators and Circulators
    o    Silicon Photonics Linear Modulators
    o    Silicon Photonics True-Time-Delay and Filter Devices

    o    Silicon Photonics Array Photodetectors
    o    Photonic Integrated Circuits (PICs)
    o    Receive Phased Array Sensor (Rx-PAS) PICs
​    o    RF Photonics Transmit and Receive PICs

MP is currently planning the addition of a Design Office in Santa Barbara, to be close to the R&D and Nanofab facilities at UCSB.  We are also looking to hire an engineer to transition MP technology to AIM Photonics at SUNY, Albany, NY (the position will likely be located at the SUNY CNSE facility).  If you are looking for an exciting new position, and have experience in the design, fabrication or testing of integrated photonic devices,  PICs, or RF Photonic systems, please consider submitting your resume using the contact page of this website.